A. Feature of UHV CIGS Evaporator
- Deposition thickness : Customer specified
- Deposition material : Metals films
- Film thickness uniformity : ≤ ± 5 % on 2" substrate
- Deposition : deposition by effusion cell and plasma cell
- Throughput : up to 2" substrate x 1 sheet / batch
- Vacuum : Ultimate pressure 1.1 x 10^-9 Torr
Base pressure 2.0 x 10-8 Torr
- Vacuum chamber : process chamber & load-lock chamber
- Control system : Manual control
- Purpose : Research and development
